* This BGA Flux set is ideal for BGA & chip scale package applications of microscopic bubbles, helps prevent BGA / CSP hydroplaning. Non-Conductive and Non-corrosive when dry.
* Lower Residue.
* Softening point: 12-20°C.
* Non-Conductive When Dry.
* Non-Corrosive When Dry.
* Reduced Defects and High Reliability Assemblies.
* Ideal for BGA & Chip Scale Package Applications of Microscopic Bubbles, * Helps Prevent BGA / CSP Hydroplaning.
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